VCSEL Bare Die & Chips
940 nm VCSEL Bare Die for 3D Sensing
High-uniformity 940 nm VCSEL die for ToF depth cameras, structured-light engines, face authentication, and proximity modules.
Specifications
- Wavelength
- 940 nm nominal
- Format
- Single die / array options
- Use case
- ToF and structured light
- Output class
- Low to medium power options
- Support
- Optical binning and assembly guidance
Designed for compact 3D sensing emitters where wavelength stability, beam uniformity, and repeatable assembly are critical.
The die can be supplied for sampling, engineering builds, and OEM qualification with support for optical binning and packaging recommendations.
Typical applications include mobile depth sensing, AR/VR tracking, access control, service robots, and short-range LiDAR.
