
940 nm VCSEL Bare Die for 3D Sensing
High-uniformity 940 nm VCSEL die for ToF depth cameras, structured-light engines, face authentication, and proximity modules.

High-uniformity 940 nm VCSEL die for ToF depth cameras, structured-light engines, face authentication, and proximity modules.

850 nm VCSEL bare die for short-reach optical data links, sensing references, and compact optical transmitter builds. 850 nm VCSEL bare die for short-reach optical data links, sensing references, and compact optical transmitter builds.

Compact packaged 940 nm VCSEL emitter with controlled divergence for ToF depth sensing and proximity measurement. Compact packaged 940 nm VCSEL emitter with controlled divergence for ToF depth sensing and proximity measurement.

High-power VCSEL array platform for LiDAR, industrial depth sensing, gesture capture, and long-range NIR illumination. High-power VCSEL array platform for LiDAR, industrial depth sensing, gesture capture, and long-range NIR illumination.

Chip-on-board NIR illumination module for compact machine vision, biometric access, and embedded sensing products. Chip-on-board NIR illumination module for compact machine vision, biometric access, and embedded sensing products.

VCSEL line projector module for triangulation, profile measurement, robot guidance, and short-range industrial sensing. VCSEL line projector module for triangulation, profile measurement, robot guidance, and short-range industrial sensing.

Custom VCSEL driver board and optical subassembly development for OEM sensing modules and pilot production.

VCSEL-based NIR illumination and emitter subsystem concept for driver monitoring, occupant detection, and in-cabin sensing.