01 / Wavelength1
850 nm or 940 nm selection
Review sensor sensitivity, ambient-light behavior and eye-safety assumptions before choosing the emitter family.
850 nm / 940 nm
3D SENSING SOLUTION
VCSEL source planning for depth sensing, structured light and ToF cameras.
A reference-style solution page for teams evaluating VCSEL emitters, arrays and compact modules for depth perception systems.
Use this page to align wavelength, optical power, beam shape, package size and thermal limits before selecting samples or starting a custom module conversation.
APPLICATION OVERVIEW
Depth-sensing projects depend on emitter uniformity, drive control and optical geometry.
VCSEL selection starts with the imaging method: ToF, structured light, proximity sensing or gesture recognition.
The emitter package, beam pattern and driver interface need to be reviewed together because the optical target is tied to camera FOV, duty cycle, ambient light and available thermal area.
SAME SOLUTION-PAGE MODULE PATTERN
3D sensing design checkpoints
The module structure mirrors the reference solution template: proof rows, media sections, product recommendation and CTA.
View VCSEL Die
02 / Optics2
Beam shaping and field coverage
Match divergence, diffuser or DOE needs with the camera field of view and working distance.
FOV / diffuser / DOE
03 / Electronics3
Pulse drive and thermal path
Coordinate peak current, pulse width, board copper, package choice and test duty cycle.
Driver / PCB / heat
04 / Samples4
Early evaluation kits
Compare multiple emitters in the same fixture before committing to a custom mechanical outline.
Samples / test fixture
ENGINEERING SUPPORT
Prototype around the complete optical path, not only the emitter.
The right emitter still needs usable drive conditions, a stable optical stack and measurable test criteria.
PhotonEdge demo pages use standard modules to show how an engineer can move from solution context into product comparison, then into sample or ODM requests.
RECOMMENDED FOR 3D SENSING
VCSEL products for depth-camera evaluation
Bare die, ToF packages and compact modules that fit common depth-sensing prototype paths.
VCSEL Bare Die & Chips
940 nm VCSEL Bare Die for 3D Sensing
High-uniformity 940 nm VCSEL die for ToF depth cameras, structured-light engines, face authentication, and proximity modules.
VCSEL Bare Die & Chips
850 nm VCSEL Bare Die for Data Communication
850 nm VCSEL bare die for short-reach optical data links, sensing references, and compact optical transmitter builds. 850 nm VCSEL bare die for short-reach optical data links, sensing references, and compact optical transmitter builds.
Packaged VCSEL Devices
940 nm ToF VCSEL Emitter Package
Compact packaged 940 nm VCSEL emitter with controlled divergence for ToF depth sensing and proximity measurement. Compact packaged 940 nm VCSEL emitter with controlled divergence for ToF depth sensing and proximity measurement.
Packaged VCSEL Devices
High-Power Multi-Junction VCSEL Array
High-power VCSEL array platform for LiDAR, industrial depth sensing, gesture capture, and long-range NIR illumination. High-power VCSEL array platform for LiDAR, industrial depth sensing, gesture capture, and long-range NIR illumination.
RELATED ENGINEERING NOTES
3D sensing articles and checklists
Use the notes section to review selection cases and module-request preparation.
Jun 26, 2026
3D Sensing Module Case: 940 nm VCSEL Emitter Selection
A demo case note on choosing wavelength, beam profile, package, and driver assumptions for a compact ToF depth module.
Jun 26, 2026
Automotive Cabin Sensing Case: NIR Illumination Path
A short application case for driver monitoring and occupant sensing teams comparing VCSEL NIR illumination choices.
Jun 26, 2026
VCSEL Module Requirement Checklist for OEM Projects
A practical checklist for wavelength, optical power, beam shape, drive mode, thermal path, compliance, and pilot-run planning.
START A 3D SENSING PROJECT
Need an emitter or module shortlist for a depth camera?
Send the wavelength, field of view, working distance and package constraints. The request will be routed into the ODM workflow.
Standard samples and custom assemblies can be reviewed together.
3D Sensing
Depth-sensing VCSEL sample and module planning
ToF / structured light / proximity